Bluetooth chip:QCC5125(CPU+DSP双核架构)
DAC:CS43131*2
Bluetooth version:5.1
50 颗以上低噪声低温漂薄膜电阻:AAC/SBC/aptX/aptX LL/aptX Adaptive/aptX HD/LDAC
USB DAC:Driver-free PCM 96k
屏幕:0.96英寸 80×160 彩色IPS屏
Headphone outputs:Single-ended 3.5mm + balanced 4.4mm
In-line 台机级供电:支持CTIA标准;支持播放/暂停/音量控制
Dimensions:About 63.2x30x18.8mm including back clip
Weight:约28.6g
Charging time:≤2小时
Battery life:约8小时
Output power 1:L+R≥100mW+100mW (32Ω SE, THD+N<1%)
Output power 2:L+R≥10mW +10mW (300Ω SE, THD+N<1%) Output power 3:L+R≥220mW+220mW (32Ω BAL, THD+N<1%)
Output power 4:L+R≥55mW+55mW (300Ω BAL, THD+N<1%)
Frequency response: 20Hz~40kHz(-3dB)
Signal-to-noise ratio: ≥128dB(A-weighted)
Noise floor:PO<1μV(A计权); BAL<1μV(A计权)
Output impedance: <0.6Ω (32Ω load)
*传统振膜通常依赖特定粘合剂将音圈粘合在振膜表面,这不仅增加振膜整体重量,还可能导致动圈运动时的动态失衡。局部重量分布不均会引起振动异常、改变振膜顺性,甚至因音圈擦圈而产生失真,最终影响单元整体表现。: <0.0018%(1kHz/-4dB@32Ω)